BSS192PE6327
vs
SP0610TE-6327
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
SIEMENS A G
|
| Package Description |
ROHS COMPLIANT PACKAGE-3
|
SMALL OUTLINE, R-PDSO-G3
|
| Pin Count |
3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
LOGIC LEVEL COMPATIBLE
|
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| DS Breakdown Voltage-Min |
250 V
|
60 V
|
| Drain Current-Max (ID) |
0.19 A
|
0.13 A
|
| Drain-source On Resistance-Max |
12 Ω
|
10 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
8 pF
|
|
| JESD-30 Code |
R-PSSO-F3
|
R-PDSO-G3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
255
|
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NOT SPECIFIED
|
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
SINGLE
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare BSS192PE6327 with alternatives
Compare SP0610TE-6327 with alternatives