BU2362FV
vs
BU7346GUL-E2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
LSSOP, TSSOP16,.25
|
VFBGA, BGA6,2X3,20
|
| Pin Count |
16
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
R-PBGA-B6
|
| JESD-609 Code |
e2
|
|
| Length |
5 mm
|
1.5 mm
|
| Number of Terminals |
16
|
6
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-25 °C
|
-5 °C
|
| Output Clock Frequency-Max |
36.8688 MHz
|
38 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP16,.25
|
BGA6,2X3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Primary Clock/Crystal Frequency-Nom |
27 MHz
|
27 MHz
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.35 mm
|
0.55 mm
|
| Supply Current-Max |
45 mA
|
4.6 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
1 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare BU2362FV with alternatives
Compare BU7346GUL-E2 with alternatives