BU4001B-E2 vs TC4001BP feature comparison

BU4001B-E2 ROHM Semiconductor

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TC4001BP Toshiba America Electronic Components

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.4 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 90 ns 200 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer Toshiba
Max I(ol) 0.012 A
Power Supply Current-Max (ICC) 0.03 mA
Prop. Delay@Nom-Sup 200 ns
Seated Height-Max 4.45 mm

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Compare TC4001BP with alternatives