BU4011BFV-E2
vs
BU4011BFV-T1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
LSSOP, SSOP14,.25
|
LSSOP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e2
|
e2
|
| Length |
5 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
SSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
90 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.6 mm
|
1.35 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
TIN COPPER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BU4011BFV-E2 with alternatives
Compare BU4011BFV-T1 with alternatives