BU4013BF vs 935245290112 feature comparison

BU4013BF ROHM Semiconductor

Buy Now Datasheet

935245290112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description LSOP, SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.7 mm 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 175 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 2 mm
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 5.3 mm
fmax-Min 14 MHz 20 MHz
Base Number Matches 1 1
Rohs Code Yes
Peak Reflow Temperature (Cel) 260
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) 40

Compare BU4013BF with alternatives

Compare 935245290112 with alternatives