BU4013BF vs CD4013BFMSH feature comparison

BU4013BF ROHM Semiconductor

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CD4013BFMSH Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD INTERSIL CORP
Part Package Code SOIC
Package Description LSOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 8.7 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code LSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE IN-LINE
Propagation Delay (tpd) 175 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm
fmax-Min 14 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 405 ns
Screening Level 38535V;38534K;883S
Terminal Finish Tin/Lead (Sn/Pb)
Total Dose 1M Rad(Si) V

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