BU4013BF vs HEF4013BPN feature comparison

BU4013BF ROHM Semiconductor

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HEF4013BPN Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROHM CO LTD PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description LSOP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.7 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE IN-LINE
Propagation Delay (tpd) 175 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm
fmax-Min 14 MHz
Base Number Matches 1 2
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 7000000 Hz
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 220 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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