BU8241FS-T1
vs
UAA2079M-T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP
|
|
| Package Description |
SSOP-24
|
SSOP,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e3/e2
|
|
| Length |
10 mm
|
8.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.01 mm
|
2 mm
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
| Terminal Finish |
TIN/TIN COPPER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
5.4 mm
|
5.3 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
-10 °C
|
| Supply Voltage-Nom |
|
3 V
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare BU8241FS-T1 with alternatives
Compare UAA2079M-T with alternatives