BUF634P
vs
CLC111AMC
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP-8
|
DIE, DIE OR CHIP
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.33.00.01
|
Date Of Intro |
1993-07-01
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
Amplifier Type |
BUFFER
|
BUFFER
|
Average Bias Current-Max (IIB) |
20 µA
|
15 µA
|
Bandwidth (3dB)-Nom |
180 MHz
|
450 MHz
|
Bias Current-Max (IIB) @25C |
20 µA
|
15 µA
|
Input Offset Voltage-Max |
100000 µV
|
9000 µV
|
JESD-30 Code |
R-PDIP-T8
|
X-XUUC-N
|
JESD-609 Code |
e4
|
|
Length |
9.59 mm
|
|
Neg Supply Voltage Limit-Max |
-18 V
|
-7 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-5 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Equivalence Code |
DIP8,.3
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Packing Method |
TUBE
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
|
Slew Rate-Nom |
2000 V/us
|
3500 V/us
|
Supply Current-Max |
20 mA
|
12 mA
|
Supply Voltage Limit-Max |
18 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
1
|
Output Current-Min |
|
0.05 A
|
Screening Level |
|
38535Q/M;38534H;883B
|
Slew Rate-Min |
|
2700 V/us
|
|
|
|
Compare BUF634P with alternatives
Compare CLC111AMC with alternatives