BUF634P vs CLC111AMC feature comparison

BUF634P Texas Instruments

Buy Now Datasheet

CLC111AMC Texas Instruments

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP-8 DIE, DIE OR CHIP
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.33.00.01
Date Of Intro 1993-07-01
Samacsys Manufacturer Texas Instruments
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 20 µA 15 µA
Bandwidth (3dB)-Nom 180 MHz 450 MHz
Bias Current-Max (IIB) @25C 20 µA 15 µA
Input Offset Voltage-Max 100000 µV 9000 µV
JESD-30 Code R-PDIP-T8 X-XUUC-N
JESD-609 Code e4
Length 9.59 mm
Neg Supply Voltage Limit-Max -18 V -7 V
Neg Supply Voltage-Nom (Vsup) -15 V -5 V
Number of Functions 1 1
Number of Terminals 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP8,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Packing Method TUBE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 2000 V/us 3500 V/us
Supply Current-Max 20 mA 12 mA
Supply Voltage Limit-Max 18 V 7 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 2 1
Output Current-Min 0.05 A
Screening Level 38535Q/M;38534H;883B
Slew Rate-Min 2700 V/us

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