BUK637-500B vs APT4025BNR feature comparison

BUK637-500B NXP Semiconductors

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APT4025BNR Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ADVANCED POWER TECHNOLOGY INC
Package Description FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Configuration SINGLE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 500 V 400 V
Drain Current-Max (ID) 10 A 23 A
Drain-source On Resistance-Max 0.8 Ω 0.25 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Element Material SILICON SILICON
Base Number Matches 3 2
Rohs Code No
HTS Code 8541.29.00.95
Additional Feature AVALANCHE RATED
Avalanche Energy Rating (Eas) 1210 mJ
Case Connection DRAIN
JEDEC-95 Code TO-247AD
JESD-609 Code e0
Operating Temperature-Max 150 °C
Power Dissipation Ambient-Max 310 W
Power Dissipation-Max (Abs) 310 W
Pulsed Drain Current-Max (IDM) 92 A
Terminal Finish Tin/Lead (Sn/Pb)

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