BUK9217-75B
vs
BUK9217-75B,118
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
Drain Current-Max (ID) |
64 A
|
64 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
185 °C
|
185 °C
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
167 W
|
167 W
|
Surface Mount |
YES
|
YES
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
DPAK
|
Package Description |
|
PLASTIC, SC-63, DPAK-3
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT428
|
HTS Code |
|
8541.29.00.75
|
Additional Feature |
|
LOGIC LEVEL COMPITABLE
|
Avalanche Energy Rating (Eas) |
|
147 mJ
|
Case Connection |
|
DRAIN
|
DS Breakdown Voltage-Min |
|
75 V
|
Drain-source On Resistance-Max |
|
0.017 Ω
|
JEDEC-95 Code |
|
TO-252AA
|
JESD-30 Code |
|
R-PSSO-G2
|
JESD-609 Code |
|
e3
|
Number of Terminals |
|
2
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Pulsed Drain Current-Max (IDM) |
|
256 A
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|