BUK9508-55B,127 vs 934055644127 feature comparison

BUK9508-55B,127 NXP Semiconductors

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934055644127 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TO-220
Package Description PLASTIC, SC-46, 3 PIN FLANGE MOUNT, R-PSFM-T3
Pin Count 3
Manufacturer Package Code SOT78A
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Additional Feature LOGIC LEVEL COMPATIBLE
Avalanche Energy Rating (Eas) 352 mJ 670 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 55 V 55 V
Drain Current-Max (ID) 75 A 75 A
Drain-source On Resistance-Max 0.0093 Ω 0.0085 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-220AB TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 203 W
Pulsed Drain Current-Max (IDM) 439 A 503 A
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare BUK9508-55B,127 with alternatives

Compare 934055644127 with alternatives