BZV55-B16
vs
BZV55-B16135
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
O-LELF-R2
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
unknown
|
Samacsys Manufacturer |
NXP
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
40 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.4 W
|
0.4 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
16 V
|
16 V
|
Reverse Current-Max |
0.05 µA
|
0.05 µA
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin (Sn)
|
TIN
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Voltage Temp Coeff-Max |
14 mV/°C
|
14 mV/°C
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
10
|
2
|
|
|
|
Compare BZV55-B16 with alternatives
Compare BZV55-B16135 with alternatives