CA3059
vs
TEA1124
feature comparison
Pbfree Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
TEMIC SEMICONDUCTORS
|
Part Package Code |
PDIP-14
|
|
Package Description |
DIP-14
|
DIP-8
|
Pin Count |
14
|
|
Manufacturer Package Code |
646-06
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
onsemi
|
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
|
Length |
18.86 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
8
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
235
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.69 mm
|
|
Supply Voltage-Max (Vsup) |
7 V
|
|
Supply Voltage-Min (Vsup) |
6 V
|
|
Supply Voltage-Nom (Vsup) |
6.1 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CA3059 with alternatives
Compare TEA1124 with alternatives