CA3059
vs
TEA1124
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-14
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.05 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.334 mm
|
|
| Supply Voltage-Max (Vsup) |
7 V
|
|
| Supply Voltage-Min (Vsup) |
6 V
|
|
| Supply Voltage-Nom (Vsup) |
6.4 V
|
5.6 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
9
|
2
|
|
|
|