CAT1163WI-30TE13
vs
CAT1163WI-30-G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ONSEMI
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e3
|
e4
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max |
6 V
|
|
| Supply Voltage-Min |
2.7 V
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
3
|
1
|
| Manufacturer Package Code |
|
751BD
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
|
|
|
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