CBT16212DL vs CBTD16212DL,118 feature comparison

CBT16212DL NXP Semiconductors

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CBTD16212DL,118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SSOP
Package Description PLASTIC, SSOP-56 SSOP,
Pin Count 56 56
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e4 e4
Length 18.425 mm 18.425 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 2
Number of Bits 12 12
Number of Functions 1 1
Number of Ports 4 4
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP56,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 6 1

Compare CBT16212DL with alternatives

Compare CBTD16212DL,118 with alternatives