CBTD16211DL,518
vs
IDT74FST163211PV
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
PLASTIC, SOT-371-1, SSOP3-56
|
SSOP, SSOP56,.4
|
| Pin Count |
56
|
56
|
| Manufacturer Package Code |
SOT371-1
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| JESD-609 Code |
e4
|
e0
|
| Length |
18.425 mm
|
18.415 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.8 mm
|
2.794 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
TTL COMPATIBLE BUS SWITCH
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
SSOP56,.4
|
| Technology |
|
CMOS
|
|
|
|
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