CC2540F128RHAR
vs
CC2540F128RHAT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
VQFN-40
|
VQFN-40
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Bus Compatibility |
SPI; USART; USB
|
SPI; USART; USB
|
JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
JESD-609 Code |
e4
|
e4
|
Length |
6 mm
|
6 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of I/O Lines |
21
|
21
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC40,.24SQ,20
|
LCC40,.24SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
8192
|
8192
|
RAM (words) |
8
|
8
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2 V
|
2 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
6 mm
|
6 mm
|
uPs/uCs/Peripheral ICs Type |
Bluetooth SoC
|
Bluetooth SoC
|
Base Number Matches |
1
|
1
|
|
|
|