CCLM2700
vs
CMJ2700TIN/LEAD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
CENTRAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOD
|
|
| Package Description |
SOD-80, 2 PIN
|
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD-80
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
300000 Ω
|
|
| JESD-30 Code |
O-LELF-R2
|
R-PDSO-F2
|
| JESD-609 Code |
e0
|
e0
|
| Limiting Voltage-Max |
2.7 V
|
2.7 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Power Dissipation-Max |
0.8 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
|
| Regulation Current-Nom (Ireg) |
2.69 mA
|
2.69 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
FLAT
|
| Terminal Position |
END
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
9
|
1
|
| Date Of Intro |
|
2018-01-31
|
|
|
|
Compare CCLM2700 with alternatives
Compare CMJ2700TIN/LEAD with alternatives