CD4011AE vs HEF4011UBP feature comparison

CD4011AE Intersil Corporation

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HEF4011UBP Philips Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERSIL CORP PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description PLASTIC, MO-001-AB, DIP-14 DIP-14
Pin Count 14
Reach Compliance Code not_compliant not_compliant
Family 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0
Length 19.17 mm
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 100 ns 120 ns
Propagation Delay (tpd) 100 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.33 mm
Supply Voltage-Max (Vsup) 12 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 2
HTS Code 8542.39.00.01
Max I(ol) 0.00035999999999999997 A

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