CD4011BE vs HEF4011BP feature comparison

CD4011BE General Electric Solid State

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HEF4011BP Philips Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V 5/15 V
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 7 2
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.00036 A
Prop. Delay@Nom-Sup 110 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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