CD4011BE vs HEF4011UBDB feature comparison

CD4011BE Thomson Consumer Electronics

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HEF4011UBDB NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 7 1
Source Content uid HEF4011UBDB
Family 4000/14000/40000
Load Capacitance (CL) 50 pF
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 120 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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