CD4011BMJ/883
vs
TC4011BF(TP1)
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
TOSHIBA CORP
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
SOIC
|
Package Description |
|
0.300 INCH, PLASTIC, SOIC-14
|
Pin Count |
|
14
|
Family |
|
4000/14000/40000
|
JESD-30 Code |
|
R-PDSO-G14
|
JESD-609 Code |
|
e0
|
Length |
|
10.3 mm
|
Load Capacitance (CL) |
|
50 pF
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
240
|
Propagation Delay (tpd) |
|
200 ns
|
Seated Height-Max |
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
|
18 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
5.3 mm
|
|
|
|
Compare CD4011BMJ/883 with alternatives
Compare TC4011BF(TP1) with alternatives