CD4011CN vs HEF4011BPN feature comparison

CD4011CN Harris Semiconductor

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HEF4011BPN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Logic IC Type NAND GATE NAND GATE
Qualification Status Not Qualified Not Qualified
Base Number Matches 5 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer NXP
Family 4000/14000/40000
JESD-30 Code R-PDIP-T14
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Prop. Delay@Nom-Sup 110 ns
Propagation Delay (tpd) 110 ns
Schmitt Trigger NO
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

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