CD4011CN
vs
HEF4011UBP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
,
|
DIP-14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
5
|
2
|
| Rohs Code |
|
Yes
|
| JESD-30 Code |
|
R-PDIP-T14
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.00035999999999999997 A
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
|
120 ns
|
| Schmitt Trigger |
|
NO
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare CD4011CN with alternatives