CD4012AD vs MC14012UBCP feature comparison

CD4012AD Intersil Corporation

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MC14012UBCP Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 2
Number of Inputs 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 75 ns 180 ns
Propagation Delay (tpd) 150 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 12 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 4
Rohs Code No
JESD-609 Code e0
Power Supplies 5/15 V
Terminal Finish Tin/Lead (Sn/Pb)

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