CD4013BCN vs HEF4013BDF feature comparison

CD4013BCN Rochester Electronics LLC

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HEF4013BDF NXP Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, MS-001, DIP-14 DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e3
Length 19.18 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 350 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 7.6 MHz 7 MHz
Base Number Matches 4 1
Load Capacitance (CL) 50 pF

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Compare HEF4013BDF with alternatives