CD4013BCN vs HEF4013BTSDB-T feature comparison

CD4013BCN Texas Instruments

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HEF4013BTSDB-T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-14 SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.18 mm 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 350 ns 220 ns
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.3 mm
fmax-Min 7.6 MHz 20 MHz
Base Number Matches 4 1
Qualification Status Not Qualified

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