CD4013BDMS vs HCC4013BF feature comparison

CD4013BDMS Harris Semiconductor

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HCC4013BF SGS-Ates Componenti Electronici SPA

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR SGS-ATES COMPONENTI ELECTRONICI S P A
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 405 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 16 MHz
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 400 ns
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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