CD4013BDMSH vs CD4013BHMS feature comparison

CD4013BDMSH Intersil Corporation

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CD4013BHMS Intersil Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP HARRIS SEMICONDUCTOR
Package Description DIP, DIP14,.3 DIE,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 X-XUUC-N14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Prop. Delay@Nom-Sup 405 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535V;38534K;883S
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Total Dose 1M Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 2
Family 4000/14000/40000
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 405 ns
fmax-Min 16 MHz

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