CD4013BF3A vs HEF4013BU feature comparison

CD4013BF3A Rochester Electronics LLC

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HEF4013BU NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DIP WAFER
Package Description DIP, ,
Pin Count 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 X-XUUC-N
JESD-609 Code e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
Base Number Matches 4 2
HTS Code 8542.39.00.01
Propagation Delay (tpd) 220 ns
fmax-Min 20 MHz

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