CD4013BFX vs HCC4013BF feature comparison

CD4013BFX Rochester Electronics LLC

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HCC4013BF SGS-Ates Componenti Electronici SPA

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC SGS-ATES COMPONENTI ELECTRONICI S P A
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
Base Number Matches 4 2
HTS Code 8542.39.00.01
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 400 ns