CD4013BFX vs HEF4013BPB feature comparison

CD4013BFX RCA

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HEF4013BPB NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer RCA SOLID STATE NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 400 ns
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 4 1
Part Package Code DIP
Pin Count 14
Family 4000/14000/40000
Length 19.025 mm
Load Capacitance (CL) 50 pF
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 220 ns
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm
fmax-Min 7 MHz

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