CD4013BH
vs
CD4013BFMSH
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
RCA SOLID STATE
|
INTERSIL CORP
|
Package Description |
, DIE OR CHIP
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Functions |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Code |
DIE
|
DIP
|
Package Equivalence Code |
DIE OR CHIP
|
DIP14,.3
|
Prop. Delay@Nom-Sup |
400 ns
|
405 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Base Number Matches |
4
|
2
|
Rohs Code |
|
No
|
JESD-30 Code |
|
R-XDIP-T14
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
50 pF
|
Max Frequency@Nom-Sup |
|
3500000 Hz
|
Max I(ol) |
|
0.00035999999999999997 A
|
Number of Terminals |
|
14
|
Package Body Material |
|
CERAMIC
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Screening Level |
|
38535V;38534K;883S
|
Surface Mount |
|
NO
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Total Dose |
|
1M Rad(Si) V
|
|
|
|