CD4013BHMS vs CD4013BF feature comparison

CD4013BHMS Intersil Corporation

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CD4013BF General Electric Solid State

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR GENERAL ELECTRIC SOLID STATE
Package Description DIE, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code X-XUUC-N14 R-XDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material UNSPECIFIED CERAMIC
Package Code DIE DIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 405 ns
Qualification Status Not Qualified Not Qualified
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 16 MHz
Base Number Matches 2 8
Rohs Code No
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 400 ns
Terminal Pitch 2.54 mm

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