CD4017BD3A vs HD74LS393FPEL feature comparison

CD4017BD3A Intersil Corporation

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HD74LS393FPEL Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.3
Pin Count 16 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 LS
JESD-30 Code R-CDIP-T16 R-PDSO-G14
Load/Preset Input YES NO
Logic IC Type RING COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS ASYNCHRONOUS
Number of Bits 10 4
Number of Functions 1 2
Number of Terminals 16 14
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C -20 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 650 ns 60 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Length 10.06 mm
Max Frequency@Nom-Sup 25000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 26 mA
Seated Height-Max 2.2 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm
fmax-Min 25 MHz

Compare CD4017BD3A with alternatives

Compare HD74LS393FPEL with alternatives