CD4023AD3 vs CD4093BMN feature comparison

CD4023AD3 Rochester Electronics LLC

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CD4093BMN Texas Instruments

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description PACKAGE-14 DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 450 ns
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 19.18 mm
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare CD4093BMN with alternatives