CD4023AD3 vs MC14023UBCPDS feature comparison

CD4023AD3 Rochester Electronics LLC

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MC14023UBCPDS Motorola Mobility LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code DIP DIP
Package Description PACKAGE-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 180 ns
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 18.86 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.69 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CD4023AD3 with alternatives

Compare MC14023UBCPDS with alternatives