CD4023AE
vs
MC14023UBCL
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Base Number Matches |
4
|
4
|
| Rohs Code |
|
No
|
| Package Description |
|
DIP, DIP14,.3
|
| JESD-30 Code |
|
R-XDIP-T14
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
NAND GATE
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Power Supplies |
|
5/15 V
|
| Prop. Delay@Nom-Sup |
|
180 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|