CD4023BDMSR vs HEF4023BP feature comparison

CD4023BDMSR Renesas Electronics Corporation

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HEF4023BP Philips Semiconductors

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Pbfree Code Yes
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP PHILIPS SEMICONDUCTORS
Part Package Code SBDIP
Package Description DIP, DIP-14
Pin Count 14
Manufacturer Package Code D14.3
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Renesas Electronics
Family 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
JESD-609 Code e3
Logic IC Type NAND GATE NAND GATE
Number of Functions 3
Number of Inputs 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 338 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 20 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Width 7.62 mm
Base Number Matches 3 2
Rohs Code Yes
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 135 ns
Schmitt Trigger NO

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