CD4050BD3
vs
5962-01-226-5601
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
PACKAGE-16
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Additional Feature |
CMOS-TTL LEVEL TRANSLATOR
|
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-CDIP-T16
|
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
BUFFER
|
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
6
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
3
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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