CD4050BF3A vs CD4050BD3 feature comparison

CD4050BF3A Texas Instruments

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CD4050BD3 Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-16 PACKAGE-16
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-CDIP-T16
JESD-609 Code e0 e0
Length 19.05 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0064 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supply Current-Max (ICC) 0.06 mA
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 140 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm
Base Number Matches 4 3
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Moisture Sensitivity Level NOT SPECIFIED

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