CD4050BMJ/883
vs
M38510/05554BEA
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
QP SEMICONDUCTOR INC
|
Package Description |
,
|
DIP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Base Number Matches |
3
|
5
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Family |
|
4000/14000/40000
|
JESD-30 Code |
|
R-GDIP-T16
|
JESD-609 Code |
|
e0
|
Logic IC Type |
|
BUFFER
|
Number of Functions |
|
6
|
Number of Inputs |
|
1
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Propagation Delay (tpd) |
|
345 ns
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-PRF-38535 Class B
|
Supply Voltage-Max (Vsup) |
|
15 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Position |
|
DUAL
|
|
|
|
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