CD4060BFX vs HEF4060BDF feature comparison

CD4060BFX Harris Semiconductor

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HEF4060BDF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-GDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Load/Preset Input NO YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00035999999999999997 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 14 14
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 740 ns 420 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Base Number Matches 3 1
Part Package Code DIP
Pin Count 16
Seated Height-Max 5.08 mm
Width 7.62 mm
fmax-Min 30 MHz

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