CD4076BDMSR vs HEF4076BD feature comparison

CD4076BDMSR Harris Semiconductor

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HEF4076BD NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature HOLD MODE; DUAL OUTPUT ENABLE; RADIATION HARDENED WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T16 R-GDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max I(ol) 0.00035999999999999997 A
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 810 ns
Propagation Delay (tpd) 810 ns 305 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535V;38534K;883S
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 2.22 MHz 4 MHz
Base Number Matches 3 2
Part Package Code DIP
Pin Count 16
Max Frequency@Nom-Sup 4000000 Hz

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