CD4099BDMSR
vs
CD4099BPWRE4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SBDIP
|
TSSOP
|
| Package Description |
DIP,
|
TSSOP, TSSOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
D16.3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Additional Feature |
1:8 DMUX FOLLOWED BY LATCH
|
LATCH ACTS AS 1-OF-8 DEMULTIPLEXER
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-CDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
540 ns
|
400 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
|
| Seated Height-Max |
5.08 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Gold (Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
|
| Trigger Type |
LOW LEVEL
|
LOW LEVEL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Length |
|
5 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
400 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CD4099BDMSR with alternatives
Compare CD4099BPWRE4 with alternatives