CD4508BF
vs
HEF4508BP
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
WITH CLEAR
|
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-GDIP-T24
|
R-PDIP-T24
|
| Logic IC Type |
BUS DRIVER
|
D LATCH
|
| Number of Bits |
4
|
4
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
7
|
2
|
| Rohs Code |
|
No
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.00035999999999999997 A
|
| Package Equivalence Code |
|
DIP24,.6
|
| Prop. Delay@Nom-Sup |
|
230 ns
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
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