CD4512BPW vs HEC4539BD feature comparison

CD4512BPW Texas Instruments

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HEC4539BD NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description TSSOP, TSSOP16,.25 DIP,
Pin Count 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-CDIP-T16
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0015 A
Moisture Sensitivity Level 1
Number of Bits 8
Number of Functions 1 2
Number of Inputs 8 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 3 mA
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 360 ns 330 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 7.62 mm
Base Number Matches 6 2

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