CD4541BPWG4
vs
HEF4541BT,652
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
TSSOP, TSSOP14,.25
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Count Direction |
UP
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e4
|
Length |
5 mm
|
8.65 mm
|
Load/Preset Input |
YES
|
YES
|
Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
Mode of Operation |
SYNCHRONOUS
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
16
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
18000 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
4.4 mm
|
3.9 mm
|
Base Number Matches |
2
|
1
|
Manufacturer Package Code |
|
SOT108-1
|
|
|
|
Compare CD4541BPWG4 with alternatives
Compare HEF4541BT,652 with alternatives